Phoenix-extract

Sustainable Circular

Without acids, poisons or burning

copper circuit board from scrap

industrial test circuit board edges copper fraction

fiberglass, copper, resin powder

Fractions after grinding and sorting bga and ic

connector and cable grinding copper fractions

resin powder, copper, fiberglass

gold wire from bga and ic chips

metals prepared for measurement

copper silver gold

Copper Faction

gold thread fraction from chips

Our work

- 2011 Self-developed Cable Grinding System

- 2013 Further development of our own developed cable grinding system

- 2015 Self-developed shredder and grinder system for PCB waste

- 2016 Self-developed shredder and grinder system and sorting copper connector included

- 2017 Self-developed grinding sorting system for processing BGA and IC chips purely mechanically

- 2018 Development of a medium-sized industrial PCB waste grinding and sorting system

- 2019 Development of a small-scale PCB waste grinding and sorting system up to 500 microns in size

- 2020 Further development of our own water-cooled grinders

-2021-22 Further development and improvement of the hydro impact mill to achieve fractions between 500-200 microns

- 2023 production of copper powder fraction from copper fraction selected from PCB waste

-2024 Automation of further improvements to grinding and sorting systems

-2025 Preparation of plans for automated, tested and operational machines for introduction to the market, perfectly suited for series production of machines

- 2026 Plans are to create a composite material of glass fiber and resin powder from the non-metallic fraction on an industrial scale, thus complying with the ETS 2 regulatory system.

Machines developed and manufactured by us

2015 Shredder grinder production is self-developed

2016 waste copper containing Connection grinding and sorting system

2017 Shredder grinder further development

2018-2020 Development of a PCB die waste sorting and separation system

2019 Self-developed water-cooled grinding machine up to 500 micron fraction size

2019 PCB die grinding and sorting plant for 500 micron size fractions

2021 Further development and improvement of the hydro impact mill to achieve fractions between 500-200 microns

2022 Self-developed wet sorting machine for sorting metal particles below 200 microns

Our component productions

shredder parts

Grinding knife for tests, own production

Manufacturing of grinder housings

Production of self-made grinder shaft

schredder cutting shaft manufacturing

Self-made discharge belt + magnetic separator

Non-metallic fractions and composite material production trials

PCB waste non-metallic part

composite material cover

Fiberglass fraction from PCB waste

resin powder fraction from PCB waste

composite tests with the addition of glass fiber and resin powder fractions

Machine washers

board sheet composite test

Outdoor Freezing Composite Test

Custom casting test composite material

Composite tests

patio cover test made of composite material

terrace covering test made of composite material in different colors

Box production using fiberglass and resin powder fractions from PCB waste, resulting from composite materials

Our finished visuals and production plans

Waste recycling in an innovative way.

Our company's main activity is the development of technologies for electronic waste processing in a way that is unique in the world.

Our team has been developing technologies for recycling electronic waste since 2010, such as extracting the gold content of BGA and IC chips.

In 2016, we had operational systems that were able to extract the gold content of BGA and IC chips purely mechanically without acids or other chemical processes.